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handling precautions p ermanent damage to the MASW6020G may occur if the following precautions are not adhered to: a. cleanliness ?the MASW6020G should be handled in a clean e nv i r o n m e n t . do not attempt to clean unit after the MASW6020G is installed. b. static sensitivity ?all chip handling equipment and personnel should be dc grounded. c. tr ansient ?a v oid instrument and po w er supply transients while bias is applied to the MASW6020G. use shielded signal and bias cables to minimize inductive pick-up . d. bias ?apply voltage to either control port a/b or only when the other is grounded. neither port should be allo w ed to ?loat. e. general handling ?it is recommended that the MASW6020G chip be handled along the long side of the die with a sharp pair of bent tweezers . do not touch the surface of the chip with fingers or tweezers . mounting the MASW6020G is bac k - m e t a l l i z ed with pd/ni/au (100/1,000/ 30,000?) metallization. it can be die-mounted with ausn eutectic preforms or with thermally conductive epoxy . the package surface should be clean and flat before attachment. eutectic die attach: a. a 80/20 gold/tin preform is recommended with a work surface temperature of approximately 255? and a tool temperature of 265? . when hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be approximately 290? . b. do not expose the MASW6020G to a temperature greater than 320? for more than 20 seconds . no more than 3 seconds of scrubbing should be required for attachment. epo xy die attach: a. electrically conductive epoxy must be used. b. apply a minimum amount of epoxy and place the MASW6020G into position. a thin epoxy fillet should be visible around the perimeter of the chip . c. cure epoxy per manufacturer's recommended schedule . wire bonding a. ball or wedge bond with 1.0 mil diameter pure gold wire. t h e rm o - sonic wirebonding with a nominal stage temperature of 150? and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. u l t r asonic energy and time should be adjusted to the minimum levels to achieve reliab l e w i r e b o n d s . b. wirebonds should be started on the chip and terminated on the p a ck a g e . handling, mounting, and bonding procedure MASW6020G t ruth t able maximum ratings control v oltage (a/b): -8.5 vdc max input rf p ow er : +34 dbm (500 mhz - 4 ghz) storage t emperature: -65? to +175? maximum operating t emperature: +175? rf1, rf2: 0.004 x 0.006 (0.100 x 0.150) alt rf: 0.004 x 0.005 (0.100 x 0.125) a,b: 0.004 x 0.004 (0.100 x 0.100) gnd1: 0.012 x 0.007 (0.300 x 0.175) gnd2 : 0.009 x 0.008 (0.225 x 0.200) t erm: 0.004 x 0.008 (0.100 x 0.200) switch condition option control v olta ge & bonding ground bonds a b rf1 rf2 al t gnd1 gnd2 t erm v hi v lo w on on g g v lo w v hi off off g g v hi v lo w on on g g v lo w v hi off off g g v hi v lo w on on g g v lo w v hi off off g g
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